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Common connection methods of IC and LCD

1. SMT

SMT is the abbreviation of "Surface mount technology" in English, that is, surface mount technology, which is a more traditional installation method. Its advantages are high reliability, but its disadvantages are large size and high cost, which limit the miniaturization of LCM.

 

2. COB

COB is the abbreviation of "Chip On Board" in English, that is, the chip is bonded on the PCB, which not only saves materials such as PCB boards, but also greatly reduces the size of the module and reduces the price. As IC manufacturers reduce the output of QFP (a type of SMT) package in the production of LCD control and related chips, the traditional SMT method will gradually be replaced in future products.

 

3. TAB

TAB is the abbreviation of "Tape Aotomated Bonding" in English, that is, anisotropic conductive adhesive is used to connect. The IC in TCP (Tape Carrier Package) package is fixed on LCD and PCB with anisotropic conductive adhesive. This installation method can reduce the weight and volume of the LCM, which is easy to install and more reliable.

 

4. COG

COG is the abbreviation of "Chip On Glass" in English, that is, the chip is directly bonded to the glass. This installation method can reduce the volume of the entire LCD module, is easy to mass-produce, and is suitable for LCDs used in electronic products, such as mobile phones, watches, mp3 and other portable electronic products. This installation method, driven by IC manufacturers, will be the main connection method between IC and LCD in the future.

 

5. COF

COF is the abbreviation of "Chip On Film" in English, that is, the chip is directly mounted on the flexible PCB. This connection method is highly integrated, and peripheral components can be mounted on the flexible PCB together with the IC. This is an emerging technology that has entered the pilot production stage.



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